Copper 3D Printing

✓ On-demand functional parts, MOQ = 1 piece

✓ Unmatched thermal & electrical conductivity (up to 100% IACS)

✓ Real-time process monitoring to prevent oxidation and porosity

Why 3D Metal Printing Copper Excels in Thermal Management & Electronics

Laser-based SLM/DED technology enables copper’s unique advantages:

•Heat dissipation 5x faster than aluminum

•High-purity conductivity (99.9% Cu) for low-resistance electrical paths

•Complex cooling channels impossible with traditional casting

Parameter Pure CopperCuCrZrGlidCop AL-60
Particle Size (μm) 15-45 (DED optimized)20-53 (SLM optimized)15-45 (SLM optimized)
Flowability (ASTM B213) 30 s/50g28 s/50g28 s/50g
Apparent Density (g/cm³) 4.54.24.0
Oxygen Content (ppm) ≤500≤300≤200
Sphericity ≥0.85≥0.88≥0.90

APTPROTOTYPE provides oxygen-free copper and advanced alloys optimized for laser 3D printing, meeting ASTM B152 and ISO 431 standards.

Material Grade	Key Advantages	Target Industries
Pure Copper (C11000)	100% IACS conductivity, 385 W/m·K thermal	RF waveguides, heat sinks
CuCrZr (C18150)	High strength (≥300 MPa), 80% IACS	Rocket nozzles, welding electrodes
GlidCop® (AL-60)	Dispersion-strengthened, 85% IACS	Fusion reactor components

High-power green lasers (515 nm) for reduced reflectivity (<5% energy loss)

Argon-shielded chambers with O₂ <50 ppm

Pure copper: 99.95% density as-printed (no HIP required)

CuCrZr: Solution annealing + aging for 450 MPa UTS

Thermal/electrical simulation for channel optimization

In-house EDM machining for support removal

Electronics: Ultra-low-loss inductor coils (Q-factor >200)

Energy: Nuclear fusion first wall panels with embedded sensors

Automotive: Direct-printed electric motor windings

Enhance copper parts with:

Surface treatments: Anti-oxidation coating (Ag plating)

Heat treatment: Age hardening for CuCrZr (480°C/4h)

Testing: 4-wire resistance measurement (ASTM B193)

Q: How to overcome copper’s laser reflectivity in SLM?

A: We use 515 nm green lasers (vs. 1064 nm IR) to boost absorption by 400%, enabling stable melting.

Q: Can you print copper-aluminum hybrid parts?

Yes – Our multi-material DED systems enable bimetallic interfaces for heat exchangers.

For pure copper SLM:

Use minimum wall thickness ≥1.5 mm to prevent collapse.

Orient lattice structures at 45° to the build plate for optimal conductivity.

With 20 years of growth and innovation, we are committed to providing the best digital manufacturing experience in the industry.

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